Advancements in microarchitecture facilitate the creation of smaller, higher-performing devices. They’re also the driving force behind Intel’s business model and success. Through a commitment to smart design and intelligent process technology, Intel continues to lead the industry toward ever-smaller transistors, resulting in more energy-efficient, higher-performing processor cores.
Microarchitecture is a blueprint of chip elements. This blueprint, when combined with advanced nanotechnology, enables computing devices to be more capable and energy efficient. Intel’s microarchitecture team continues to make giant leaps in innovation and has recently introduced the world’s first 3D transistors manufactured at 22 nm.
Discover the benefits of the new Intel® microarchitecture, formerly known as Haswell, supporting faster and smaller platforms, better HD graphics, more security, faster response, and better mobility with automatic wireless connections.
Driven by Moore's Law and the Tick-Tock model, Intel has continued its historic accomplishments in the microarchitecture field by successfully testing the first 3D 22 nm transistor and by developing next-generation 14 nm technologies.
Introduced in 3rd generation Intel® Core™ processors, the Intel® 3D, 22 nm microarchitecture marks a turning point in the fundamental structure of the computer chip. Until now, transistors were 2D (planar) devices. The Intel® 3D tri-gate transistor uses three gates wrapped around the silicon channel in a 3D structure, enabling an unprecedented combination of powerful performance and ultra-low power consumption.
This new technology enables Intel to create ever more powerful microprocessors with higher performance, longer battery life at lower costs, and smaller form factor devices such as the Ultrabook™.
Continued innovations in microarchitecture have powered the Intel® Atom™ processor, the smallest and most versatile processor in the Intel family. The Intel Atom processor enables a broad range of companion devices, including netbooks, tablets, handhelds, smartphones, Smart TVs, Intelligent Systems, and consumer electronics, providing smaller devices with unparalleled audio and video performance.
Intel® Many Integrated Core Architecture (Intel® MIC Architecture) is the latest advance in supercomputing speed, performance, and compatibility, offering up to a teraflop of peak floating-point performance on a single chip. Intel MIC Architecture employs a high degree of parallel processing and targets the high performance computing (HPC) market, which relies on parallel processing to create climate simulations, financial models, genetic analysis, and medical images, among other things.
Intel Fellow Mark Bohr discusses the new 14 nm transistor process and how the tri-gate fins are now taller, thinner, and closer together, enabling more performance, less active power, and longer battery life for greater computing experiences.